Wayne State University
College of Engineering
Detroit, Michigan
Overview
Wayne State University evolved from a one-year premedical program incorporated into Central High School to serve the forty-five-year-old Detroit Medical College. Successive educational needs led to junior college, city college, and city university status. In 1956, Wayne became a state university. It is now composed of eleven colleges and schools plus the Graduate School and the Center for Urban Studies. Its buildings have been designed by some of the finest architects in the world and are surrounded with beautiful landscaping to serve human needs. The University spirit is one of intellectual curiosity.
The University is accredited by the North Central Association of Colleges and Schools. Last year, the College's research programs attracted more than $14 million in grants, and contracts from government agencies and public and private institutions.
Approximately 27,500 students are enrolled at Wayne State University. The College of Engineering currently enrolls approximately 1,340undergraduates and 1,180 graduate students. Approximately 50 percent of engineering graduate students come from the state of Michigan.
The Location and Community
Located in the heart of Detroit, the University is surrounded by an area that offers many industrial, business, and cultural opportunities. Nearby are major research and production centers devoted to chemicals, pharmaceuticals, computers, telecommunications, fuels, metallurgy, and automobiles and automotive equipment. The area is also a center for highway and construction industries and has one of the largest hospital complexes in the nation. Among the cultural attractions are professional and university theaters; opera and symphony orchestras; art galleries and institutes; museums; classical, jazz, and soul music; and top international and Broadway entertainment. Detroit is the home of the exciting Renaissance Center. The Henry Ford Museum and Greenfield Village, where American history is reenacted, are only a short drive away. The Detroit River, Lake St. Clair, and numerous smaller lakes attract water sports enthusiasts. Michigan, a tourist state, has many lakes, beaches, forests, and skiing areas.
Programs of Study and Degree Requirements
Education of engineers for leadership in urban society involves an expanded treatment of the traditional engineering disciplines. Interaction among the pure sciences, the engineering sciences, and the social sciences, together with unusual opportunities for research, prepares the graduate for his or her profession.
The College of Engineering includes the Departments of Chemical Engineering and Materials Science, Civil and Environmental Engineering, Electrical and Computer Engineering, Industrial and Manufacturing Engineering, and Mechanical Engineering and the Division of Engineering Technology. Special programs include automotive engineering, bioengineering, environmental and infrastructure engineering, noise and acoustics, quality control, reliability engineering, energy research, transportation, vehicle systems, engineering management, manufacturing, control systems, combustion, photonics, microelectronics, smart sensors, and interdisciplinary programs.
A master's degree is awarded after completion of the minimum 32 semester hours of credit. Ph.D. candidates complete a minimum of 60 semester hours beyond the master's degree, of which 30 semester hours apply to the dissertation requirement.
Graduates of the College have found career opportunities in industry, research laboratories, universities, and government agencies.
Facilities & Resources
The College of Engineering has a wide range of general undergraduate, departmental, and research laboratories as well as support facilities. The Center for Automotive Research provides a focus for a broad range of interdisciplinary research in diesel and gasoline engines, automotive electronics, engine and vehicle noise, alternative fuels, and automobile safety. The Bioengineering Center operates in close collaboration with the Wayne Medical School on a range of programs, with emphasis on biomechanics studies. Computer-aided manufacturing and robotics are studied through the industrial engineering and mechanical engineering departments and the Division of Engineering Technology. Additional research laboratories include an acoustics and vibrations laboratory; a laboratory for the study of gasoline and diesel combustion characteristics; a structures and earthquake systems laboratory; a composite materials testing laboratory; an environmental kinetics laboratory; materials, fluids, and metallurgical laboratories; a solid-state electronics laboratory; a microprocessor laboratory; a smart-sensor laboratory; and molecular beams and laser light scattering laboratories.
Excellent computer facilities are available to students and faculty through both the College's Computer Aided Design Laboratory and the University's Computing Services Center. In the College, networked Sun computer systems accommodate extensive CAD/CAM/graphics software. For larger studies, the University's center features a Cray J916 Vector Parallel supercomputer, which is accessible through remote terminals over the MERIT network.
Expenses and Aid
Tuition for a full-time resident graduate student is $390.75 per credit hour; the nonresident rate is $864.95 per credit hour. Eight credits is considered a minimum full-time load. (Tuition is subject to change by action of the Board of Governors.)
Financial Aid:
Many full-time students are supported through sponsored research programs or by individual departments. Fellowships, traineeships, and graduate assistantships for teaching or research typically provide stipends of $9,550 to $17,000 per academic year for part-time work, tuition waivers, and housing allowances.
Housing/Living Expenses:
The University offers housing for single and married graduate students. The Housing Office provides a list of approved off-campus accommodations.
How to Apply / Application
Applications for graduate admission, accompanied by a $20 fee ($30 for international students) and transcripts must reach the Office of Admissions by July 1 for the fall term, November 1 for the winter term, or March 15 for the spring term. The deadline for fellowships, assistantships, and scholarships is May 1. The GRE is not required for admission. A TOEFL score of at least 550 is necessary for international students.
Who to Contact
Academic Affairs
College of Engineering
Wayne State University
Detroit, Michigan 48202
313-577-3040
Graduate Programs
Alternative Enenrgy Technology
Biomedical Engineering
Chemical Engineering
Civil and Environmental Engineering
Electrical and Computer Engineering
Hazardous Waste Management Engineering
Industrial And Manufacturing Engineering
Mechanical Engineering
Faculty and Their Reserach
• Professors. Esin Gulari, Ph.D., Caltech: thermodynamics and transport properties of polymer solutions and melts, processing of polymers with supercritical fluids, light scattering based particle and drop sizing techniques. Yinlun Huang, Ph.D., Kansas State: pollution prevention and waste minimization, process modeling, control, and optimization. Ralph H. Kummler, Ph.D., Johns Hopkins: environmental fate and transport, hazardous-waste management. J. F. Louvar, Ph.D., Wayne State: experimental safety. Charles Manke, Chair; Ph.D., Berkeley: polymer rheology and processing, polymer kinetic theory. K. Y. Simon Ng, Ph.D., Michigan: heterogeneous catalysis, polymerization kinetics, spectroscopic characterization techniques. Susil Putatunda, Ph.D., Indian Institute of Technology (Bombay): physical metallurgy, fatigue and fracture toughness of metals. Erhard W. Rothe, Ph.D., Michigan: chemical kinetics, laser imaging and spectroscopy of combusting systems.
• Associate Professors. Rangaramanujam Kannan, Ph.D., Caltech: dynamics of polymeric systems and interfaces, rheo-optical spectroscopy and scattering techniques. Guang-Zhao Mao, Ph.D., Minnesota: interfacial science of complex fluids, self-assembly and thin films of polymers and surfactants. Steven O. Salley, Ph.D., Detroit: artificial internal organs and biomedical engineering. Gina Shreve, Ph.D., Michigan: biocatalysis, multiphase transport in biological systems.
• Assistant Professors. Sandro R. P. da Rocha, Ph.D., Texas at Austin: experiments and computer simulation in complex fluids, drug delivery systems, patterns from self-assembly. Howard Matthew, Ph.D., Wayne State: tissue engineering and artificial organs. Jeffrey J. Potoff, Ph.D., Cornell: molecular simulations and thermodynamics.
• Professors. Haluk Aktan, Ph.D., Michigan: civil engineering structures. Tapan K. Datta, Ph.D., Michigan State: transportation. Gongkang Fu, Ph.D., Case Western Reserve: civil engineering structures. Snehamay Khasnabis, Ph.D., North Carolina State: transportation. Carol J. Miller, Ph.D., Michigan: engineering hydraulics and environmental engineering. Mumtaz Usmen, Chairman; Ph.D., West Virginia: geotechnical and construction engineering.
• Associate Professors. Thomas M. Heidtke, Ph.D., Michigan: water resources and environmental engineering. Takaaki Kagawa, Ph.D., Berkeley: geotechnical engineering. H. C. Wu, Ph.D., MIT: infrastructure materials and structural mechanics. Nazli Yesiller, Ph.D., Wisconsin: geotechnical and geoenvironmental engineering.
• Professors. Yang Zhao, Chair; Ph.D., Penn State: photonic devices, optical communications, nanoscale optics. Gregory W. Auner, Ph.D., Wayne State: smart sensors, wide bandgap semiconductors, magnetic materials, biomedical electronics. Robert Erlandson, Ph.D., Case Western Reserve: bioengineering systems and enabling technology. Mohamad H. Hassoun, Ph.D., Wayne State: artificial neural systems, soft computing, pattern recognition. Feng Lin, Ph.D., Toronto: discrete event systems, manufacturing systems, control systems. Vladimir Mitin, Ph.D., Ukrainian Academy of Sciences: theory of nanostructures, optoelectronics, and microelectronics. Donald J. Silversmith, Ph.D., MIT: solid-state devices, microstructures fabrication. Harpreet Singh, Ph.D., Roorkee (India): computers, software engineering. Pepe Siy, Ph.D., Akron: smart sensors, VLSI design, pattern recognition. Le Y. Wang, Ph.D., McGill: robust control system design, biomedical systems. Hao Ying, Ph.D., Alabama: fuzzy control and systems, signal/image processing, neural networks, expert systems, ultrasound, clinical/biomedical applications.
• Associate Professors. Ivan Avrutsky, Ph.D., Russian Academy of Sciences: optoelectronics, theory and technology of fiber and integrated optics, semiconductor lasers. Xiaoyan Han, Ph.D., Wayne State: infrared imaging and nondestructive evaluations. Syed M. Mahmud, Ph.D., Washington (Seattle): computer architecture, parallel processing, digital system design, microprocessor-based instrumentation. James Woodyard, Ph.D., Delaware: solid-state electronics. Cheng-Zhong Xu, Ph.D., Hong Kong: parallel and distributed systems, high-performance computing.
• Assistant Professors. Q. John Cheng, Ph.D., Illinois at Urbana-Champaign: multimedia signal processing, digital communications, information/computer security. Jaewu Choi, Ph.D., Nebraska: nanotechnology and integrated microsystems. Nabil J. Sarhan, Ph.D., Penn State: multimedia systems, multimedia networking, I/O subsystems, computer architecture. Yong Xu, Ph.D., Caltech: MEMS, biomedical electronics, nanotechnology.
• Professors. Kenneth R. Chelst, Chair; Ph.D., MIT: decision and risk analysis for technical managers; globalization of engineering, manufacturing, and management; applied operations research. Donald Falkenburg, Ph.D.,Michigan: management of technology, concurrent engineering, global engineering management. Frank Plonka, Ph.D., Michigan: agile enterprise systems, technology management, architecture of production control. Nanua Singh, Ph.D., Rajasthan (India): cellular manufacturing, concurrent engineering, computer-integrated engineering. Kai Yang, Ph.D., Michigan: robust engineering, quality engineering, reliability engineering.
• Associate Professors. Ratna Babu Chinnam, Ph.D., Texas Tech: intelligent engineering systems, intelligent manufacturing, advanced quality and reliability engineering, supply chain management. Darin R. Ellis, Ph.D., Penn State: human factors engineering, human performance and aging. Olugbenga Mejabi, Ph.D., Lehigh: flexible manufacturing, simulation, factory control. Leslie F. Monplaisir, Ph.D., Missouri?Rolla: collaborative product development, computer-integrated manufacturing, supply chain optimization. Namkyu Park, Ph.D., Seoul (Korea): agile enterprise computing, supply chain management, design informatics and bioinspired systems, knowledge management, manufacturing innovation strategy, global engineering management. Gary S. Wasserman, Ph.D., Georgia Tech: reliability and robust design, SPC, leading-edge computer-intensive applications in applied statistics.
• Assistant Professor. Jane Oh: eCommerce, systems integration, statistical applications and database mining, process and knowledge management.
• Professors. Victor Berdichevsky, Ph.D., Moscow: mechanics. Ronald F. Gibson, Interim Chair; Ph.D., Minnesota: mechanical behavior of composites. Naeim A. Henein, Ph.D., Michigan: combustion, energy conversion. Raouf A. Ibrahim, Ph.D., Edinburgh: nonlinear vibrations, fluid dynamics. Kenneth A. Kline, Ph.D., Minnesota: structural dynamics. Ming-Chia Lai, Ph.D., Penn State: laser diagnostics. Golam M. Newaz, Ph.D., Illinois: composites. Eugene Rivin, D.Sc., Moscow: vibration, noise, and structural dynamics. Trilochan Singh, Associate Chair; Ph.D., Berkeley: combustion, energy conversion. Chin-An Tan, Ph.D., Berkeley: dynamics, vibrations. Dinu Taraza, Ph.D., Bucharest: engine dynamics and simulation. Alan B. Whitman, Ph.D., Minnesota: classical mechanics. Sean F. Wu, Ph.D., Georgia Tech: acoustics, vibrations. King Hay Yang, Ph.D., Wayne State: biomechanics.
• Associate Professors. Emmanuel O. Ayorinde, Ph.D., Nottingham (England): vibrations, composites. Nabil G. Chalhoub, Ph.D., Michigan: dynamic modeling, controls, robotics. Jerry C. Ku, Ph.D., SUNY at Buffalo: thermal-fluid sciences. Sheng Liu, Ph.D., Stanford: electronic packaging. Xin Wu, Ph.D., Michigan: metal forming.
• Assistant Professor. Joon Sang Lee, Ph.D., Iowa State: compuptational fluid dynamics.
• Professor. Mulchand S. Rathod, Director; Ph.D., Mississippi State: artificial heart, HVAC, heat transfer, energy, electronic packaging.
• Associate Professors. Vladimir Sheyman, Ph.D., Academy of Sciences, Minsk (Belarus): heat transfer, electronic packaging, IC engines, energy conversion. Mukasa E. Ssemakula, Ph.D., Manchester (England): manufacturing processes, CIM, process planning. Chih-Ping Yeh, Ph.D., Texas A&M: image processing, computer vision, signal processing, communication. Ece Yaprak, Ph.D., Wayne State: computer network and communications.
• Assistant Professors. Radian Belu, Ph.D., Western Ontario: power, controls, communications. Gene Liao, D.Eng., Michigan: manufacturing, CAD/CAM, robotics.